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Huaguang UV-W Plate is a new kind of green environment-friendly printing product. After exposure, there is no need for washing with developer, it needs only simple gumming process.
Compared with the conventional UV-CTP plate, The development of the UV-W plate is a physic process other than a chemical process. Therefore, the performance of the plate will not be affected by developing temperature, developing time and developing replenishment, which makes the plate-making process more stable.
UV-W Plate has many characteristics: firstly, it can be shortened the ready- plate-making time, improving the efficiency of plate- making; secondly, it can be reduced the clean out unite and chemical solution and thus save the cost and time; thirdly, effectively reduce emissions and pollution, build green printing; fourthly, minimize the impact on the properties of plate due to processing conditions, improve the quality of plate and keep plate-making stability.
1.Technical specifications

Plate type
chemistry-free UV-W CTP Plate
Spectral sensitivity
350420 nm
Gauge
0.15 mm0.30 mm and etc.
Substrate
Electronically grained ,anodized and hole sealing aluminum substrate
Laser energy
20-40 mJ/cm2
resolution
298% @200 lpi
developer
Not required
 latent image stability
7 days
Plate-making contrast
Plate-making contrast is clearly. It can be measured with all available densitometers and dot meter
storage condition
Storage room temperature≤25 relative humidity temperature≤60 %.
Shelf life
12 months under recommended storage conditions.
Run length
100,000 impressions, depend on the specific printing conditon.
Baking
Not recommended

2Matching chemicals

Plate cleaner
Huaguang chemistry-free printing plate cleaner
Washout gum
Huaguang chemistry-free washout gum
Protective gum
None required
Image remover
compatible with CTP image remover
Fountain solution
Compatible with most fountain solution and alcohol fountain solution
Roller and brush
Glunz & Jensen chemistry-free cleaner is recommended.

3Clean out unite

Plate width
200830 nm
Plate length
3101100 nm
Plate thickness
0.150.30 nm
Plate-rinsing speed
With a stable speed 0.6 m/min

 
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